Small Double Wave Soldering Machine

The 800mm preheating section is divided into two independently controlled zones using hot air circulation, heating boards gradually from room temperature up to 180°C. This staged approach prevents thermal shock, reduces warping on thinner substrates, and prepares solder pads for optimal wetting — directly lowering bridge and cold-joint defect rates.

The 180kg tin furnace, powered at 7kW, provides a large thermal reservoir that resists temperature drops when boards enter the wave. PID intelligent control maintains the solder bath within tight tolerances up to 300°C, ensuring consistent joint formation across every board in a production batch.

A touchscreen interface combined with GUXIN PLC control gives operators clear access to conveyor speed, zone temperatures, and process recipes. Parameters can be stored and recalled for different product types, reducing changeover time and minimizing the risk of human error during setup.

While startup draws 13kW, steady-state operation requires only 5kW — a meaningful reduction in power costs for factories running continuous shifts. The 3-phase 380V input is compatible with standard industrial power infrastructure in most manufacturing regions.

At 2700×1250×1600mm, the machine fits into tight production line layouts. A built-in air cooling zone after the solder wave solidifies joints before boards exit the conveyor, and integrated exhaust ducting connects to facility fume extraction systems for a cleaner working environment.