Lapping and Polishing Machine(double sides)
Precision double-sided lapping and polishing for wafers, seals, and optical components.
Industrial double-sided lapping machine engineered for semiconductor fabs, optical manufacturers, and precision component producers requiring sub-micron surface finishes. Processes brittle materials from silicon wafers to ceramic substrates with ±0.001mm flatness control in single-setup operations.
Key Specs
Key Specs
Power
Weight
Speed
Overview Points
Dual Face Processing
Universal Material Compatibility
Pneumatic Pressure Control
Swiss PLC Precision
NSK Spindle System
Batch Processing Capacity
Independent Drive Control
Automated Setup Features
Key Features
A grating-based thickness measurement system with 0.001mm resolution feeds directly into the ABB PLC, maintaining finished part thickness within ±0.002mm and flatness within ±0.001mm. The segmental pneumatic pressure system, built on SMC components, lets operators dial in exact downforce for each processing stage — from aggressive stock removal to final polishing — without compromising dimensional accuracy.
The machine handles optical glass, sapphire, quartz crystal, silicon wafers, ceramics, ferrite, gallium arsenide, and hardened metal seals on a single platform. Five star wheels with Z=108/DP12 gearing accommodate batch runs of small parts or individual large workpieces up to 202mm diameter, with processing thickness ranging from 0.3mm to 50mm.
NSK spindle bearings deliver the rotational precision and wear resistance needed for continuous lapping cycles. Each drive axis — upper plate, lower plate, and central sun gear — runs on an independent motor, allowing operators to fine-tune relative speeds between 0 and 60 rpm for optimal material removal rates and surface quality.
A ball-screw-driven lifting table brings the work surface to an ergonomic loading height. The upper plate features automatic floating alignment to eliminate manual plate registration, while a single control handle governs fast lift, fast lower, slow rise, and slow descent. Semi-automatic ring gear and splash guard lifting further reduces changeover time between batches.
A mechanical locking mechanism holds the upper plate securely in place during unexpected air or power loss, preventing disc drop incidents. An integrated signal tower provides real-time visual status, and the emergency stop is positioned within easy reach on the control panel.
Technical Specifications
The workpiece to be ground and polished is placed on the lower grinding disc, and the upper and lower grinding discs rotate relatively or in the same direction. The workpiece is rotated or revolved by the carrier of the central gear, and the pressure is applied to the upper grinding disc through the cylinder. The workpiece and the grinding disc Make relative movement and even friction to achieve the purpose of grinding and polishing the workpiece.
Mainly used in optical glass, crystal, quartz wafer, sapphire glass, lithium niobate, gallium arsenide, ceramics, sheet ferrite, silicon wafer, valve plate, valve plate, friction plate, rigid sealing ring, cylinder piston ring, oil pump Double-plane grinding and grinding of metal and non-metal hard and brittle materials such as blades polishing.
| S.N | Description | Data |
| 1 | Grinding size | Φ640mm*Φ235mm |
| 2 | Maximum processing size | 202mm |
| 3 | Processing thickness size | 0.3-50mm |
| 4 | Disc speed | 0-60rpm |
| 5 | Parameters and quantity of star wheel | Z=108/DP12 5pcs |
| 6 | Total power（kw/380v) | 6kw |
| 7 | Barometric pressure | 0.5-0.6Mpa |
| 8 | Size | 1700*1300*2500mm |
| 9 | Weight | 1750kg |
Applications
Semiconductor wafer thinning and surface preparation (silicon, gallium arsenide, sapphire)
Optical glass and quartz crystal finishing for lenses and prisms
Mechanical seal and valve plate lapping for pumps and compressors
Ceramic substrate polishing for electronic and thermal components
Piston ring and cylinder seal double-face grinding for engines and hydraulics
Lithium niobate and piezoelectric material processing for sensors and transducers
Video
FAQ
The key specifications of Lapping and Polishing Machine(double sides) include: Power: 6kw, Weight: 1750kg, Speed: 0-60rpm. Contact us for the full specification sheet.
Lapping and Polishing Machine(double sides) is widely used in: Semiconductor wafer thinning and surface preparation (silicon, gallium arsenide, sapphire); Optical glass and quartz crystal finishing for lenses and prisms; Mechanical seal and valve plate lapping for pumps and compressors; Ceramic substrate polishing for electronic and thermal components.
All NTBOBO machines come with a 1-year warranty from the date of Bill of Lading. Our engineering team provides 24-hour technical support throughout the warranty period.
We accept 30% down payment by T/T (Telegraphic Transfer), with the balance due before shipment. Other payment arrangements can be discussed for long-term partners.
Standard delivery is within 10-35 working days after receiving the down payment, depending on the machine model and customization requirements.
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