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Small Double Wave Soldering Machine

Small Double Wave Soldering Machine

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NO.ItemParameter
1Maximum substrate width230mm
2PCB board transportation height760±10mm
3PCB board transportation speed0-1.8M/Min
4Preheating zone length800mm
5Number of preheating zones2
6Preheating zone power6kw
7Preheating zone temperatureRoom temperature—180°C
8Heating method hotAir circulation
9Number of cooling zones1
10Cooling methodAir cooling
11Tin furnace power7kw
12Tin melting capacity of tin furnace180kg
13Tin furnace temperatureroom temperature: -300°C
14Temperature control modePID intelligent temperature control
15Machine control modeTouch screen + GUXIN PLC control
16Power supply3-phase 5-wire system 380V
17Starting power13kw
18Normal operating power5kw
19Production efficiency3500-4500pcs/8hfs (based on 150X150mm power supply product)
20Air source4—7KG/CM2 12.5L/Min
21Frame sizeL2000×W1200×H1600MM
22DimensionsL2700×W1250×H1600MM
23Weight Approx.850kg


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